Home  Chapter  |  News   |   Personalities  |   Service  |   e-Journal  |   History Pantheon  |  Bibliography  Rus / Eng  |   Contacts  |   Forum   |   Links

 

 

 

Michael Pecht

Ph. Doctor

 

Director: CALCE Electronic Products and Systems
George Dieter Chair Professor of Mechanical Engineering
Professor of Applied Mathematics (prognostics and health management)
University of Maryland
College Park, Maryland 20742
USA

1+301-405-5323

e-mail:  pecht@calce.umd.edu

 


www.calce.umd.edu

 

Michael Pecht, Visiting Professor in Electronics Engineering City University of Hong Kong, and Director CALCE Electronics Products and Systems Center – University of Maryland - USA

 

Prof Michael Pecht is currently visiting Professor in Electronics Engineering at City University of Hong Kong. He has an MS in Electrical Engineering and an MS and PhD in Engineering Mechanics from the University of Wisconsin at Madison. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow and an IMAPS Fellow. He was awarded the highest reliability honor, the IEEE Reliability Societyʼs Lifetime Achievement Award in 2008. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum.  He is chief editor for Microelectronics Reliability and an associate editor for the IEEE Transactions on Components and Packaging Technology. He is the founder of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, College Park, where he is also the George Dieter Chair Professor in Mechanical Engineering and a Professor in Applied Mathematics.

 

He has written more than twenty books on electronic products development, use and supply chain management and over 400 technical articles.  He has been leading a research team in the area of prognostics for the past ten years. He has consulted for over 100 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems. He has previously received the European Micro and Nano-Reliability Award for outstanding contributions to reliability research, 3M Research Award for electronics packaging, and the IMAPS William D. Ashman Memorial Achievement Award for his contributions in electronics reliability analysis.